The new XF733 embraces two technologies. The well-tried VSM CERAMICS grinding technology for high stock removal and an extended service life and the new additional grinding-active layer VSM STEARATE Plus for considerably reduced chip adhesion are perfect together. This translates into a much enhanced service life in conjunction with a markedly higher stock removal. This helps to optimize the grinding process.
BENEFITS 
The new additional anti-adhesive layer ensures the efficiency of VSM STEARATE Plus across the entire service life of the abrasive whereas conventional abrasives are more likely to clog, which has a severely detrimental effect on the performance of the abrasive.
NF metals tend to clog the abrasive. The chips can no longer be removed and build up on the tip of the grain. This is how built-up edges are formed. The grain stops working and the abrasive can no longer be used.
VSM STEARATE Plus prevents chip adhesion and therefore clogging of the abrasive. As a result, the service life of the abrasive is enhanced considerably and stock removal remains high.
